Edge list

Results from ConceptNet 5.8

Source: OpenCyc 2012
en wafer deposition (n)
― IsA ⟶
Weight: 1.0
en thin film deposition (n) Source: OpenCyc 2012
en copper electroplating (n)
― IsA ⟶
Weight: 1.0
en thin film deposition (n) Source: OpenCyc 2012
en epitaxy (n)
― IsA ⟶
Weight: 1.0
en thin film deposition (n) Source: OpenCyc 2012
en copper electroplating (n)
― IsA ⟶
Weight: 1.0
en thin film deposition (n) Source: OpenCyc 2012
en industrial thin film electroplating (n)
― IsA ⟶
Weight: 1.0
en thin film deposition (n) Source: OpenCyc 2012
en copper electroplating (n)
― IsA ⟶
Weight: 1.0
en thin film deposition (n) Source: OpenCyc 2012
en chemical vapor deposition (n)
― IsA ⟶
Weight: 1.0
en thin film deposition (n) Source: OpenCyc 2012
en thin film vacuum deposition (n)
― IsA ⟶
Weight: 1.0
en thin film deposition (n) Source: OpenCyc 2012
en thin film deposition (n)
― IsA ⟶
Weight: 1.0
en microfabrication (n) Source: OpenCyc 2012
en atomic layer deposition (n)
― IsA ⟶
Weight: 1.0
en thin film deposition (n) Source: OpenCyc 2012
en thin film vacuum deposition (n)
― IsA ⟶
Weight: 1.0
en thin film deposition (n) Source: OpenCyc 2012
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